JPH0353507Y2 - - Google Patents
Info
- Publication number
- JPH0353507Y2 JPH0353507Y2 JP5296287U JP5296287U JPH0353507Y2 JP H0353507 Y2 JPH0353507 Y2 JP H0353507Y2 JP 5296287 U JP5296287 U JP 5296287U JP 5296287 U JP5296287 U JP 5296287U JP H0353507 Y2 JPH0353507 Y2 JP H0353507Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- glass
- base
- semiconductor package
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 57
- 239000004065 semiconductor Substances 0.000 claims description 31
- 238000007789 sealing Methods 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5296287U JPH0353507Y2 (en]) | 1987-04-08 | 1987-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5296287U JPH0353507Y2 (en]) | 1987-04-08 | 1987-04-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63159843U JPS63159843U (en]) | 1988-10-19 |
| JPH0353507Y2 true JPH0353507Y2 (en]) | 1991-11-22 |
Family
ID=30878592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5296287U Expired JPH0353507Y2 (en]) | 1987-04-08 | 1987-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353507Y2 (en]) |
-
1987
- 1987-04-08 JP JP5296287U patent/JPH0353507Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63159843U (en]) | 1988-10-19 |
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